@ARTICLE{Choi_Woo_Lim_Characteristics_2019,
 author={Choi, Woo Lim and Lee, Jong-Hyun},
 volume={vol. 64},
 number={No 2},
 journal={Archives of Metallurgy and Materials},
 pages={507-512},
 howpublished={online},
 year={2019},
 publisher={Institute of Metallurgy and Materials Science of Polish Academy of Sciences},
 publisher={Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences},
 abstract={Ag and Cu powders were mechanically alloyed using high-energy planetary milling to evaluate the sinter-bonding characteristics of a die-attach paste containing particles of these two representative conductive metals mixed at atomic scale. This resulted in the formation of completely alloyed Ag-40Cu particles of 9.5 µm average size after 3 h. The alloyed particles exhibited antioxidation properties during heating to 225°C in air; the combination of high pressure and long bonding time at 225°C enhanced the shear strength of the chip bonded using the particles. Consequently, the chips sinter-bonded at 225°C and 10 MPa for 10 min exhibited a sufficient strength of 15.3 MPa. However, an increase in bonding temperature to 250°C was detrimental to the strength, due to excessive oxidation of the alloyed particles. The mechanically alloyed phase in the particle began to decompose into nanoscale Ag and Cu phases above a bonding temperature of 225°C during heating.},
 type={Artykuły / Articles},
 title={Characteristics of Die-Attach Method by Sinter Bonding Using AG-40CU Mechanically Alloyed Particles},
 URL={http://ochroma.man.poznan.pl/Content/111308/PDF/AMM-2019-2-11-Lee.pdf},
 doi={10.24425/amm.2019.127568},
 keywords={Mechanical alloying, Ag-Cu, Die-attach, Sinter bonding, Shear strength},
}