@ARTICLE{Bae_Sung_Hwa_Effect_2019,
 author={Bae, Sung Hwa and Han, Se Hun and Son, Injoon and Kim, Kyung Tae},
 volume={vol. 64},
 number={No 3},
 journal={Archives of Metallurgy and Materials},
 pages={963-968},
 howpublished={online},
 year={2019},
 publisher={Institute of Metallurgy and Materials Science of Polish Academy of Sciences},
 publisher={Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences},
 abstract={In this study, the effect of electroless Pd-P plating on the bonding strength of the Bi-Te thermoelectric elements was investigated. The bonding strength was approximately doubled by electroless Pd-P plating. Brittle Sn-Te intermetallic compounds were formed on the bonding interface of the thermoelectric elements without electroless Pd-P plating, and the fracture of the bond originated from these intermetallic compounds. A Pd-Sn solder reaction layer with a thickness of approximately 20 µm was formed under the Pd-P plating layer in the case of the electroless Pd-P plating, and prevented the diffusion of Bi and Te. In addition, the fracture did not occur on the bonding interface but in the thermoelectric elements for the electroless Pd-P plating because the bonding strength of the Pd-Sn reaction layer was higher than the shear strength of the thermoelectric elements.},
 type={Artykuły / Articles},
 title={Effect of Pd-P Layer on the Bonding Strength of Bi-Te Thermoelectric Elements},
 URL={http://ochroma.man.poznan.pl/Content/113009/PDF/AMM-2019-3-28-Son.pdf},
 doi={10.24425/amm.2019.129481},
 keywords={Bismuth-Telluride, Thermoelectric module, Electroless Pd-P plating, Bonding strength},
}