@ARTICLE{Jo_Kyeong_Hwan_Die_2020,
 author={Jo, Kyeong Hwan and Lee, Jong-Hyun},
 volume={vol. 65},
 number={No 3},
 journal={Archives of Metallurgy and Materials},
 pages={1057-1061},
 howpublished={online},
 year={2020},
 publisher={Institute of Metallurgy and Materials Science of Polish Academy of Sciences},
 publisher={Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences},
 abstract={A paste containing Cu(II) formate rods was prepared, and characteristics of sinter bonding at 250°C under a pressure of 10 MPa were investigated to accomplish a high-speed die attachment for wide-bandgap power chips on Cu finish in air. Synthesis of the plate-type Cu formate particles from CuO was accomplished through a wet reaction for 180 min. Cu, formed in situ in the bondline by pyrolysis of the formate during heating for the attachment, was sufficiently active to lead high-speed sintering within a carbon dioxide-hydrogen atmosphere derived from the pyrolysis, and the oxide layer on the Cu finish was reduced by the hydrogen. As a result, sinter bonding for 10 min formed a robust bonding with a shear strength approaching 27 MPa.},
 type={Article},
 title={Die Attachment Method on a Cu Finish by Pressure-Assisted Sinter Bonding in Air Using Cu Formate Paste},
 URL={http://ochroma.man.poznan.pl/Content/116382/PDF/AMM-2020-3-15-Jong-Hyun%20Lee.pdf},
 doi={10.24425/amm.2020.133217},
 keywords={Die attach, Cu formate paste, Sinter bonding, Cu finish, shear strength},
}