@ARTICLE{Ciszewski_P._Processing_2020,
 author={Ciszewski, P. and Sochacki, M.},
 volume={28},
 number={4},
 journal={Opto-Electronics Review},
 pages={197-202},
 howpublished={online},
 year={2020},
 publisher={Polish Academy of Sciences (under the auspices of the Committee on Electronics and Telecommunication) and Association of Polish Electrical Engineers in cooperation with Military University of Technology},
 abstract={The paper describes a research on assessing the quality of edges resulting from the interaction of laser pulses with a material of rigid and flexible printed circuits. A modern Nd:YVO4 crystal diode-pumped solid-state laser generating a 532 nm wavelength radiation with a nanosecond pulse time was used for the research. Influence of laser parameters such as beam power and pulse repetition frequency on a heat affected zone and carbonization was investigated. Quality and morphology of laser-cut substrates were analyzed by optical microscopy. High quality laser cutting of printed circuit board substrates was obtained without delamination and surface damage, with a minimal carbonization and heat affected zone. The developed process was implemented on the printed circuit assembly line.},
 type={Article},
 title={Processing of printed circuit boards using a 532 nm green laser},
 URL={http://ochroma.man.poznan.pl/Content/118245/PDF-MASTER/OPELRE_28_2020_P_Ciszewski.pdf},
 doi={10.24425/opelre.2020.135258},
 keywords={laser cutting, flexible printed circuits, heat affected zone (HAZ)},
}