@ARTICLE{Tan_C.Y._A_2024,
 author={Tan, C.Y. and Mohd Salleh, M.A.A. and Saud, N. and Nabialek, M. and Rylski, A.},
 volume={vol. 69},
 number={No 2},
 journal={Archives of Metallurgy and Materials},
 pages={661-665},
 howpublished={online},
 year={2024},
 publisher={Institute of Metallurgy and Materials Science of Polish Academy of Sciences},
 publisher={Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences},
 abstract={This paper demonstrates a non-destructive technique to evaluate the internal microstructure in the Sn-Ag-Cu (SAC) solder joint through synchrotron X-ray radiation tomography. Synchrotron X-ray tomography is increasingly utilized for characterizing the internal microstructure of materials in 3D images. A 3D model is reconstructed from a set of 2D projection images taken from different angles and angular position during the sample rotation, thus it could provide a more comprehensive description of the microstructure of an alloy compared to 2D images. In this paper, it is successfully observed and evaluated the internal microstructure of a 900 μm solder joint sample. The key principles and methods of synchrotron X-ray tomography are briefly described. Examples of quantitative and qualitative assessments on the grain refinement effect of Mg addition to SAC35 solder joint are also presented in this paper.},
 type={Article},
 title={A Non-destructive Evaluation of Microstructural Analysis in Sn-Ag-Cu Solder Joint by Synchrotron X-Ray Radiation Tomography},
 URL={http://ochroma.man.poznan.pl/Content/131907/AMM-2024-2-43-Tan.pdf},
 doi={10.24425/amm.2024.149795},
 keywords={Synchrotron tomography, SPring-8, Solder joint, 3D microstructure},
}