@ARTICLE{Szałapak_Jerzy_A_2015,
 author={Szałapak, Jerzy and Kiełbasiński, Konrad and Krzemiński, Jakub and Młożniak, Anna and Zwierkowska, Elżbieta and Jakubowska, Małgorzata and Pawłowski, Radosław},
 volume={vol. 22},
 number={No 4},
 journal={Metrology and Measurement Systems},
 pages={512-530},
 howpublished={online},
 year={2015},
 publisher={Polish Academy of Sciences Committee on Metrology and Scientific Instrumentation},
 abstract={The Low Temperature Joining Technique (LTJT) using silver compounds enables to significantly increase the thermal conductivity between joined elements, which is much higher than for soldered joints. However, it also makes difficult to measure the thermal conductivity of the joint. The Laser Flash Analysis (LFA) is a non-intrusive method of measuring the temperature rise of one surface of a specimen after excitation with a laser pulse of its other surface. The main limitation of the LFA method is its standard computer software, which assumes the dimensions of a bonded component to be similar to those of the substrate, because it uses the standard Parker’s formula dedicated for one-dimensional heat flow. In the paper a special design of measured specimen was proposed, consisting of two copper plates of different size joined with the sintered silver layer. It was shown that heat properties of these specimens can also be measured after modifying the LFA method. The authors adapted these specimens by masking the false heat signal sourced from the uncovered plate area. Another adaptation was introducing a correcting factor of the heat travel distance, which was calculated with heat-flow simulations and placed into the Parker’s formula. The heat-flow simulated data were compared with the real LFA measurement results, which enabled estimation of the joint properties, e.g. its porosity.},
 type={Artykuły / Articles},
 title={A Method Of Calculating Thermal Diffusivity And Conductivity For Irregularly Shaped Specimens In Laser Flash Analysis},
 URL={http://ochroma.man.poznan.pl/Content/90360/mainfile.pdf},
 keywords={thermal diffusivity, LFA, LTJT joints, high power electronics},
}