Tytuł artykułu

Modeling of cooling of ceramic heat accumulator

Tytuł czasopisma

Archives of Thermodynamics

Rocznik

2013

Numer

No 4 December

Autorzy

Taler, Dawid ; Cisek, Piotr

Słowa kluczowe

Electric resistance heating ; Hybrid heating system ; Heat accumulator with dynamic discharge ; Central heating system

Wydział PAN

Nauki Techniczne

Zakres

161-173

Wydawca

The Committee of Thermodynamics and Combustion of the Polish Academy of Sciences and The Institute of Fluid-Flow Machinery Polish Academy of Sciences

Data

2013

Typ

Artykuły / Articles

Identyfikator

DOI: 10.2478/aoter-2013-0035 ; ISSN 1231-0956 ; eISSN 2083-6023

Źródło

Archives of Thermodynamics; 2013; No 4 December; 161-173

Rada naukowa

International Advisory Board

J. Bataille, Ecole Central de Lyon, Ecully, France

A. Bejan, Duke University, Durham, USA

W. Blasiak, Royal Institute of Technology, Stockholm, Sweden

G. P. Celata, ENEA, Rome, Italy

L.M. Cheng, Zhejiang University, Hangzhou, China

M. Colaco, Federal University of Rio de Janeiro, Brazil

J. M. Delhaye, CEA, Grenoble, France

M. Giot, Université Catholique de Louvain, Belgium

K. Hooman, University of Queensland, Australia

D. Jackson, University of Manchester, UK

D.F. Li, Kunming University of Science and Technology, Kunming, China

K. Kuwagi, Okayama University of Science, Japan

J. P. Meyer, University of Pretoria, South Africa

S. Michaelides, Texas Christian University, Fort Worth Texas, USA

M. Moran, Ohio State University, Columbus, USA

W. Muschik, Technische Universität Berlin, Germany

I. Müller, Technische Universität Berlin, Germany

H. Nakayama, Japanese Atomic Energy Agency, Japan

S. Nizetic, University of Split, Croatia

H. Orlande, Federal University of Rio de Janeiro, Brazil

M. Podowski, Rensselaer Polytechnic Institute, Troy, USA

A. Rusanov, Institute for Mechanical Engineering Problems NAS, Kharkiv, Ukraine

M. R. von Spakovsky, Virginia Polytechnic Institute and State University, Blacksburg, USA

A. Vallati, Sapienza University of Rome, Italy

H.R. Yang, Tsinghua University, Beijing, China