Details
Title
Effect of the ENEPIG Process on the Bonding Strength of BiTe-based Thermoelectric ElementsJournal title
Archives of Metallurgy and MaterialsYearbook
2021Volume
vol. 66Issue
No 4Affiliation
Kim, Subin : Kyungpook National University, Department of Materials Science and Metallurgical Engineering, Daegu, Republic of Korea ; Bae, Sung Hwa : Kyushu University Graduate School of Engineering, Department of Materials Process Engineering, Fukuoka, Japan ; Son, Injoon : Kyungpook National University, Department of Materials Science and Metallurgical Engineering, Daegu, Republic of KoreaAuthors
Keywords
thermoelectric ; ENEPIG ; bonding strength ; BiTe ; platingDivisions of PAS
Nauki TechniczneCoverage
967-970Publisher
Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of SciencesBibliography
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