Szczegóły

Tytuł artykułu

Dissolution Behavior of Metal Impurities and Improvement of Reclaimed Semiconductor Wafer Cleaning by Addition of Chelating Agent

Tytuł czasopisma

Archives of Metallurgy and Materials

Rocznik

2021

Wolumin

vol. 66

Numer

No 4

Afiliacje

Ryu, Keunhyuk : Dankook University, Department of Energy Engineering, Cheonan 31116, Republic of Korea ; Kim, Myungsuk : Dankook University, Department of Energy Engineering, Cheonan 31116, Republic of Korea ; Roh, Jaeseok : Dankook University, Department of Energy Engineering, Cheonan 31116, Republic of Korea ; Lee, Kun-Jae : Dankook University, Department of Energy Engineering, Cheonan 31116, Republic of Korea

Autorzy

Słowa kluczowe

Reclaimed silicon wafer ; Wafer cleaning ; Metal impurity ; Metal complex ; Chelating agent

Wydział PAN

Nauki Techniczne

Zakres

977-981

Wydawca

Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences

Bibliografia

[1] K. Liu, D. Zuo, X.P. Li, M. Rahman, J. Vac. Sci. Technol. B: Microelectronics and Nanometer Structures 27 (3), 1361-1366 (2009).
[2] M. Kim, K. Ryu, K.J. Lee, J. Korean Powder Metall. Inst. 28 (1), 25-30 (2021)
[3] W. Kern, J. Electrochem. Soc. 137 (6), 1887-1892 (1990).
[4] O .J. Anttila, J. Electrochem. Soc. 139 (4), 1180-1185 (1992).
[5] K. Saga, J. Electrochem. Soc. 143 (10), 3279-3284 (1996).
[6] M. Itano, F.W. Kern, M. Miyashita, T. Ohmi, IEEE Trans. Semicond. Manuf. 6 (3), 258-267 (1993).
[7] W. Kern, Handbook of silicon wafer cleaning technology, United States 2018.
[8] M. Matsuo, T. Takahashi, H. Habuka, A. Goto, Mat. Sci. Semicon. Proc. 110, 104970 (2020).
[9] G .W. Gale, D.L. Rath, E.I. Cooper, S. Estes, H.F. Okorn-Schmidt, J. Brigante, R. Jagannathan, G. Settembre, E. Adams, J. Electrochem. Soc. 148 (9), G513-G516 (2001).
[10] D. Liu, Z. Li, Y. Zhu, Z. Li, R. Kumar, Carbohydr. Polym. 111, 469-476 (2014).
[11] J.B. Fein, Geology 19 (10), 1037-1040 (1991).
[12] N. Zubair, K. Akhtar, Trans. Nonferrous Met. Soc. China 29 (1), 143-156 (2019).
[13] D. Nansheng, W. Feng, L. Fan, L. Zan, Chemosphere 35 (11), 2697-2706 (1997).
[14] A.K. Sharma, A. Singh, R.K. Mehta, S. Sharma, S.P. Bansal, K.S. Gupta, Int. J. Chem. Kinet. 43 (7), 379-392 (2011).
[15] M.Z. Mubarok, J. Lieberto, Procedia Earth Planet. Sci. 6, 457-464 (2013).
[16] D. Rai, B.M. Sass, D.A. Moore, Inorg. Chem. 26 (3), 345-349 (1987).
[17] C.H. Bamford, R.G. Compton, C.F.H. Tipper, Reactions of metallic salts and complexes, and organometallic compounds, Elsevier 1972.

Data

2021.12.28

Typ

Article

Identyfikator

DOI: 10.24425/amm.2021.136409 ; e-ISSN 2300-1909

Źródło

Archives of Metallurgy and Materials
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