Title

Analysis of C-shape Slotted MSPA for 5G Sub Band Applications on Three Different Substrates

Journal title

International Journal of Electronics and Telecommunications

Yearbook

2022

Volume

vol. 68

Issue

No 4

Affiliation

Nagaraju, P. : Department of Electronics & Telecommunication Engineering, RVCE, Bangalore, India ; Sachina, D.H. : Department of Electronics & Communication Engineering, BMSCE, Bangalore, India ; Khan, Imran : Department of Electronics & Communication Engineering, Government Engineering College, Ramanagara, India ; Kumaraswamy, H.V. : Department of Electronics & Telecommunication Engineering, RVCE, Bangalore, India ; Sudhindra, K.R. : Department of Electronics & Communication Engineering, BMSCE, Bangalore, India

Authors

Nagaraju, P. ; Sachina, D.H. ; Khan, Imran ; Kumaraswamy, H.V. ; Sudhindra, K.R.

Keywords

C-shape ; RT Duroid ; Taconic (TLC) ; FR4 ; 5G

Divisions of PAS

Nauki Techniczne

Coverage

715-719

Publisher

Polish Academy of Sciences Committee of Electronics and Telecommunications

Date

2022.12.19

Type

Article

Identifier

DOI: 10.24425/ijet.2022.143877