Szczegóły
Tytuł artykułu
Intermetallic compound layer formation in indium-based micro-bump array fabrication technology for IR detectorsTytuł czasopisma
Opto-Electronics ReviewRocznik
2024Wolumin
32Numer
1Autorzy
Afiliacje
Kozłowski, Paweł : Łukasiewicz Research Network – Institute of Microelectronics and Photonics, Al. Lotników 32/46, 02-668 Warsaw, Poland ; Jasik, Agata : Łukasiewicz Research Network – Institute of Microelectronics and Photonics, Al. Lotników 32/46, 02-668 Warsaw, Poland ; Łaszcz, Adam : Łukasiewicz Research Network – Institute of Microelectronics and Photonics, Al. Lotników 32/46, 02-668 Warsaw, Poland ; Czuba, Krzysztof : Łukasiewicz Research Network – Institute of Microelectronics and Photonics, Al. Lotników 32/46, 02-668 Warsaw, Poland ; Chmielewski, Krzysztof : Łukasiewicz Research Network – Institute of Microelectronics and Photonics, Al. Lotników 32/46, 02-668 Warsaw, Poland ; Zdunek, Krzysztof : Warsaw University of Technology, Faculty of Materials Science and Engineering, ul. Wołoska 141, 02-507 Warsaw, PolandSłowa kluczowe
indium micro-bump ; under bump metallization ; intermetallic alloy ; focused ion beam ; energy dispersive spectrometryWydział PAN
Nauki TechniczneZakres
e148833Wydawca
Polish Academy of Sciences (under the auspices of the Committee on Electronics and Telecommunication) and Association of Polish Electrical Engineers in cooperation with Military University of TechnologyData
15.12.2023Typ
ArticleIdentyfikator
DOI: 10.24425/opelre.2024.148833 ; ISSN 1896-3757Indeksowanie w bazach
Abstracting and Indexing:Arianta
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