Title

A Non-destructive Evaluation of Microstructural Analysis in Sn-Ag-Cu Solder Joint by Synchrotron X-Ray Radiation Tomography

Journal title

Archives of Metallurgy and Materials

Yearbook

2024

Volume

vol. 69

Issue

No 2

Affiliation

Tan, C.Y. : Universiti Malaysia Perlis, Centre of Excellent on Geopolymer and Green Technology (CEGeoGTech), 02600 Perlis, Malaysia ; Mohd Salleh, M.A.A. : Universiti Malaysia Perlis, Centre of Excellent on Geopolymer and Green Technology (CEGeoGTech), 02600 Perlis, Malaysia ; Saud, N. : Universiti Malaysia Perlis, Centre of Excellent on Geopolymer and Green Technology (CEGeoGTech), 02600 Perlis, Malaysia ; Nabialek, M. : Czestochowa University of Technology, Department of Physics, Faculty of Production Engineering and Materials Technology,42-200 Czestochowa, Poland ; Rylski, A. : Lodz University of Technology, Institute of Materials Science and Engineering, 90-924 Lodz, Poland

Authors

Tan, C.Y. ; Mohd Salleh, M.A.A. ; Saud, N. ; Nabialek, M. ; Rylski, A.

Keywords

Synchrotron tomography ; SPring-8 ; Solder joint ; 3D microstructure

Divisions of PAS

Nauki Techniczne

Coverage

661-665

Publisher

Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences

Date

21.06.2024

Type

Article

Identifier

DOI: 10.24425/amm.2024.149795