Tytuł artykułu

A Study on Electroless Copper Deposition for Desktop Stereolithography 3D Printing Materials

Tytuł czasopisma

Archives of Metallurgy and Materials

Rocznik

2024

Wolumin

vol. 69

Numer

No 4

Autorzy

Ahmad, A. ; Saidin Wahab, Md ; Kamarudin, K. ; Hehsan, H.

Afiliacje

Ahmad, A. : Universiti Tun Hussein Onn Malaysia, Facult y of Engineering Technology, Department of Mechanical Engineering Technology, Pagoh Edu Hub, KM 1, Jalan Panchor, 84600 Pagoh, Johor, Malaysia ; Ahmad, A. : Universiti Tun Hussein Onn Malaysia, Innovative Manufacturing Technology (IMT), Facult y of Engineering Technology, Pagoh Edu Hub, KM 1, Jalan Panchor, 84600 Pagoh, Johor, Malaysia ; Saidin Wahab, Md : Universiti Tun Hussein Onn Malaysia, Adva nced Manufact uring and Mat erials Centre (AMMC), Parit Raja, 86400 Bat u Pahat , Johor, Malaysia ; Kamarudin, K. : Universiti Tun Hussein Onn Malaysia, Facult y of Engineering Technology, Department of Mechanical Engineering Technology, Pagoh Edu Hub, KM 1, Jalan Panchor, 84600 Pagoh, Johor, Malaysia ; Kamarudin, K. : Universiti Tun Hussein Onn Malaysia, Innovative Manufacturing Technology (IMT), Facult y of Engineering Technology, Pagoh Edu Hub, KM 1, Jalan Panchor, 84600 Pagoh, Johor, Malaysia ; Hehsan, H. : Universiti Tun Hussein Onn Malaysia, Facult y of Engineering Technology, Department of Mechanical Engineering Technology, Pagoh Edu Hub, KM 1, Jalan Panchor, 84600 Pagoh, Johor, Malaysia ; Hehsan, H. : Universiti Tun Hussein Onn Malaysia, Innovative Manufacturing Technology (IMT), Facult y of Engineering Technology, Pagoh Edu Hub, KM 1, Jalan Panchor, 84600 Pagoh, Johor, Malaysia

Słowa kluczowe

Stereolithography ; Electroless copper deposition ; Optimization ; Adhesion quality

Wydział PAN

Nauki Techniczne

Zakres

1419-1424

Wydawca

Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences

Data

16.12.2024

Typ

Article

Identyfikator

DOI: 10.24425/amm.2024.151409 ; e-ISSN 2300-1909