Details
Title
Numerical Studies on Symmetrically and Asymmetrically Heated Vertical Channels with Isothermal WallsJournal title
Archives of ThermodynamicsYearbook
2025Volume
vol. 46Issue
No 4Authors
Affiliation
Rao, Chiyyedu Gururaja : Department of Mechanical Engineering, Vasavi College of Engineering, Hyderabad, IndiaKeywords
Vertical channel ; Isothermal walls ; Mixed convection ; RadiationDivisions of PAS
Nauki TechniczneCoverage
135-140Publisher
The Committee of Thermodynamics and Combustion of the Polish Academy of Sciences and The Institute of Fluid-Flow Machinery Polish Academy of SciencesDate
18.12.2025Type
ArticleIdentifier
DOI: 10.24425/ather.2025.156844Editorial Board
International Advisory BoardJ. Bataille, Ecole Central de Lyon, Ecully, France
A. Bejan, Duke University, Durham, USA
A. C. Benim, Duesseldorf University of Applied Sciences, Germany
W. Blasiak, Royal Institute of Technology, Stockholm, Sweden
G. P. Celata, ENEA, Rome, Italy
L.M. Cheng, Zhejiang University, Hangzhou, China
M. Colaco, Federal University of Rio de Janeiro, Brazil
J. M. Delhaye, CEA, Grenoble, France
M. Giot, Université Catholique de Louvain, Belgium
K. Hooman, University of Queensland, Australia
D. Jackson, University of Manchester, UK
D.F. Li, Kunming University of Science and Technology, Kunming, China
K. Kuwagi, Okayama University of Science, Japan
J. P. Meyer, University of Pretoria, South Africa
S. Michaelides, Texas Christian University, Fort Worth Texas, USA
M. Moran, Ohio State University, Columbus, USA
W. Muschik, Technische Universität Berlin, Germany
I. Müller, Technische Universität Berlin, Germany
H. Nakayama, Japanese Atomic Energy Agency, Japan
S. Nizetic, University of Split, Croatia
H. Orlande, Federal University of Rio de Janeiro, Brazil
M. Podowski, Rensselaer Polytechnic Institute, Troy, USA
A. Rusanov, Institute for Mechanical Engineering Problems NAS, Kharkiv, Ukraine
M. R. von Spakovsky, Virginia Polytechnic Institute and State University, Blacksburg, USA
A. Vallati, Sapienza University of Rome, Italy
H.R. Yang, Tsinghua University, Beijing, China