Details
Title
Heat and Mass Transfer with Entropy Generation in Immiscible Fluid Flow through a Vertical Channel under Slip and Non-Uniform Thermal ConditionsJournal title
Archives of ThermodynamicsYearbook
2026Volume
vol. 47Issue
No 1Authors
Affiliation
Kasula, Santhosh : Sreyas Institute of Engineering and Technology, Hyderabad 500068, Telangana, India ; Shekar, M.N. Raja : JNTUH University College of Engineering Science and Technology, Hyderabad 500068, Telangana, IndiaKeywords
Heat and mass transfer ; Non-uniform heat ; Vertical channel ; Entropy ; Slip effectsDivisions of PAS
Nauki TechniczneCoverage
177‒194Publisher
The Committee of Thermodynamics and Combustion of the Polish Academy of Sciences and The Institute of Fluid-Flow Machinery Polish Academy of SciencesDate
23.04.2026Type
ArticleIdentifier
DOI: 10.24425/ather.2026.158668Editorial Board
International Advisory BoardJ. Bataille, Ecole Central de Lyon, Ecully, France
A. Bejan, Duke University, Durham, USA
A. C. Benim, Duesseldorf University of Applied Sciences, Germany
W. Blasiak, Royal Institute of Technology, Stockholm, Sweden
G. P. Celata, ENEA, Rome, Italy
L.M. Cheng, Zhejiang University, Hangzhou, China
M. Colaco, Federal University of Rio de Janeiro, Brazil
J. M. Delhaye, CEA, Grenoble, France
M. Giot, Université Catholique de Louvain, Belgium
K. Hooman, University of Queensland, Australia
D. Jackson, University of Manchester, UK
D.F. Li, Kunming University of Science and Technology, Kunming, China
K. Kuwagi, Okayama University of Science, Japan
J. P. Meyer, University of Pretoria, South Africa
S. Michaelides, Texas Christian University, Fort Worth Texas, USA
M. Moran, Ohio State University, Columbus, USA
W. Muschik, Technische Universität Berlin, Germany
I. Müller, Technische Universität Berlin, Germany
H. Nakayama, Japanese Atomic Energy Agency, Japan
S. Nizetic, University of Split, Croatia
H. Orlande, Federal University of Rio de Janeiro, Brazil
M. Podowski, Rensselaer Polytechnic Institute, Troy, USA
A. Rusanov, Institute for Mechanical Engineering Problems NAS, Kharkiv, Ukraine
M. R. von Spakovsky, Virginia Polytechnic Institute and State University, Blacksburg, USA
A. Vallati, Sapienza University of Rome, Italy
H.R. Yang, Tsinghua University, Beijing, China